Copper nanoparticles seeded functionalized‐PVC plastic surface for electroless nickel deposition

A novel and facile activation process for electroless nickel deposition was developed. The semi‐interpenetrating polymer network hydrogel biofilm was used to functionalize the inert poly(vinyl chloride) (PVC) surface, and then Cu nanoparticles, which can initial the subsequent electroless nickel deposition successfully seeded on the functionalized‐PVC surface. The samples were characterized by scanning electron microscopy, X‐ray photoelectron spectroscopy, X‐ray diffraction, and transmission electron microscopy. The results show that the hydrogel film provided the PVC surface with amino groups and Cu nanoparticles of 20–50 nm in size could be functioned as the catalytic nuclei for the subsequent electroless metal deposition on PVC plastic. It can be concluded that the novel Cu activation was effective for the nickel deposition on PVC surface, because of more chemisorption sites for Cu nanoparticles generated on PVC surface. Copyright © 2013 John Wiley & Sons, Ltd.