Modifications test of vacuum deposition Ni/Cr films with Mn and Si for thin film resistors

For producing Ni/Cr thin film resistors an Si addition would be especially suitable to reduce the TCR, as Si forms several phases with Ni and Cr. By evaporating powder mixtures deposition thin films were produced with constant Cr portions of 20 at.%, 30 at.% and 40 at.% and from 5 to 50 at.% Si or Mn, rest Ni. Whereas the layers containing Mn have an exclusively positive TCR, there is a shift to negative TCR in the layers containing much Si.