金刚石膜热沉金属化Ti/Ni/Au体系的研究

利用电子束蒸镀实现了Ti/Ni/Au多层膜在CVD金刚石膜上的金属化,并研究了预处理和后处理工艺对多层膜在基底上结合的影响,发现高温预处理对多层膜和基底的结合有明显的改善.参照国标GJB 126-86进行了热循环试验,未发现多层膜从金刚石膜脱落.利用背散射谱研究了Ti/Ni/Au金属化体系在真空中分别加热400℃和500℃,60 min 金属层的热稳定性.结果发现:优化工艺金刚石膜和金属层间的良好结合和稳定性满足金刚石膜热沉应用的要求.

Study on Adhesion of Ti/Ni/Au Multilayers on Diamond Wafer

Ti/Ni/Au multilayers have been deposited by electron beam evaporation, to metallize CVD diamond wafers. The effect of pre-treatment and post-treatment on adhesion of the multi-layers to the substrates was investigated, and it was found, introducing a pre-fire at elevated temperatures, the adhesion could be improved significantly. Thermal cycling experiments were accomplished according to the Chinese national standard (GJB 126-86), and the multi-layers were not peeled off from the diamond wafers. Rutherford back-scattering spectroscopy (RBS) had been used to characterize the stability of the Ti/Ni/Au metallization scheme at 400℃, 500℃ for 60 min in vacuum. In conclusion, the good adhesion and the stability of the optimized processing between the diamond and the metal-layers can meet the required of the diamond application as heat sink.