Two Dimensions Residual Stresses Analysis Through Incremental Groove Machining Combined with Electronic Speckle Pattern Interferometry

In this study a new residual stress determination method in two directions simultaneously is presented. This method is based on stresses relaxation in a groove that is machined incrementally. The residual stresses relaxation occurs simultaneously from both the depth and the length of the groove. Thus, measuring the surface strain field generated by the relaxation enables to determine the stress gradient both along the depth and the length of the groove. To measure the surface strain in a direction perpendicular to the groove, a digital speckle pattern interferometer is used. This method is suitable when the residual stress field in the structure varies in the depth as well as along the surface of the part, like for example in a welded structure. The method is tested here on an aluminium plate in which a central band has been shot peened.