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Dynamic curving cracks in functionally graded materials under thermo-mechanical loading
Authors:Sandeep Abotula  Addis Kidane  Vijaya B Chalivendra  Arun Shukla
Institution:1. Dynamic Photo Mechanics Laboratory, Department of Mechanical, Industrial & Systems Engineering, University of Rhode Island, Kingston, RI 02881, United States;2. Department of Mechanical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States;3. Department of Mechanical Engineering, University of Massachusetts Dartmouth, North Dartmouth, MA 02747, United States
Abstract:Mixed-mode dynamic crack growth along an arbitrarily smoothly varying path in functionally graded materials (FGMs) under thermo-mechanical loading is studied. The property gradation in FGMs is considered by varying shear-modulus, mass density, thermal conductivity and coefficient of thermal expansion exponentially along the gradation direction. Asymptotic analysis in conjunction with displacement potentials is used to develop the stress fields around propagating cracks in FGMs. Asymptotic temperature fields are developed first for the exponential variation of thermal conductivity and later these temperature fields are used to derive thermo-mechanical stress fields for a curving crack in FGMs. Using these thermo-mechanical stress fields, various components of the stresses are developed and the effect of curvature parameters, temperature and gradation on these stresses are discussed. Finally, using the minimum strain energy density criterion, the effect of curvature parameters, crack-tip speeds, non-homogeneity values and temperature gradients on crack growth directions are determined and discussed.
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