温度场下岛-桥结构屈曲薄膜的动力学分析

基于岛-桥结构的柔性电子器件已被用于健康监测和皮肤电子等领域。但是柔性电子器件在工作中极易受工作温度变化等激励产生振动，进而影响器件的灵敏度与可靠性。因此本文研究在温度场作用下岛-桥结构屈曲薄膜的动力学问题。首先，基于Euler-Bernoulli梁理论，建立温度场作用下岛-桥结构屈曲薄膜的动力学控制方程。其次，通过引入新变量，将原动力学方程引入Hamilton体系中，得到相应的Hamilton正则方程。随后，采用辛Runge-Kutta方法求解该Hamilton正则方程，并与经典Runge-Kutta方法对比，数值结果显示了辛算法在求解非线性动力学方程时高精度、高数值稳定性的优势，进一步讨论了温度变化量、预应变、阻尼系数等对屈曲薄膜动力学响应的影响。本文研究为柔性电子器件动力学设计提供了理论参考。

Dynamic analysis of the buckled thin film in island-interconnector structure under thermal effect

The flexible electronic devices based on the island-interconnector structure have been used in health monitoring and skin electronics. However, flexible electronic devices are extremely affected to vibration caused by changes in operating temperature during operation, which in turn affect the sensitivity and reliability of the device. Therefore, this paper studies the dynamic behaviours of the buckled thin films which serve as interconnects in island-interconnector structure flexible electronic devices under the thermal effect. Firstly, the dynamic equations of the buckled thin films under thermal effect are derived based on the Euler-Bernoulli beam theory. Secondly, by introducing new variables, the dynamic equations are introduced into the Hamilton system, and the corresponding Hamilton regular equations are obtained. Then, the symplectic Runge-Kutta method is used to solve the Hamilton regular equations. Compared with the traditional Runge-Kutta method, the symplectic algorithm has the advantages of high precision and high numerical stability in solving nonlinear dynamic equations. Finally, the effects of temperature change, pre-strain, and damping coefficient on the dynamic response of the buckled thin film are analyzed. This study would provide a theoretical reference for the dynamic design of flexible electronic devices.