| 高速差分过孔的仿真分析 |
| |
| 引用本文： | 张格子,金丽花.高速差分过孔的仿真分析[J].信息技术,2007,31(5):99-101. |
| |
| 作者姓名： | 张格子 金丽花 |
| |
| 作者单位： | 上海交通大学电子工程系,上海,200240 |
| |
| 摘 要： | 高速差分信号传输中也存在着信号完整性问题。差分过孔在频率很高的时候会明显地影响差分信号的完整性,现介绍差分过孔的等效RLC模型,在HFSS中建立了差分过孔仿真模型并分析了过孔尤其过孔长度对信号完整性的影响。
|
| 关 键 词： | 差分过孔 信号完整性 S参数 |
| 文章编号： | 1009-2552（2007）05-0099-03 |
| 修稿时间： | 2006-10-18 |
Simulation and analysis of high- speed differential via |
| |
| ZHANG Ge-zi,JIN Li-hua.Simulation and analysis of high- speed differential via[J].Information Technology,2007,31(5):99-101. |
| |
| Authors: | ZHANG Ge-zi JIN Li-hua |
| |
| Institution: | Department of Electronic Engineering, Shanghai Jiaotong University, Shanghai 200240, China |
| |
| Abstract: | High- speed differential signal transmission could also have signal integrity problem. When frequency is above gigahertz, differential via will influence the signal integrity of differential signal. This article introduces the equivalent RLC circuit of differential via, establishes the simulation model in HFSS, and analyzes the impact of via especially via length on signal integrity. |
| |
| Keywords: | differential via signal integrity S parameter |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
