| 氯化银比浊法测定铜箔镀液中微量氯 |
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| 引用本文： | 张敏,王德淑. 氯化银比浊法测定铜箔镀液中微量氯[J]. 理化检验(化学分册), 2000, 36(6): 257-258,260 |
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| 作者姓名： | 张敏 王德淑 |
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| 作者单位： | 安徽铜陵市环境监测站,铜陵244000 |
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| 摘 要： | 采用氯化银比浊法，在不分离硫酸铜的条件下，直接测定镀铜电解液中微量氯离子。对试验条件和可能存在的干扰进行了研究，榈的加标回收率在９８．７％￣１０７．０％之间，相对标准偏差在２．７％￣８．８％之间。方法快速简单，结果满意。
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| 关 键 词： | 氯 氯化银比浊法 电镀液 铜箔 微量分析 |
TURBIDIMETRIC DETERMINATION OF MICROAMOUNTS OF CHLORIDE(AS AgCl)IN COPPER ELECTROPLATING SOLUTION |
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| Zhang Ming,wang Deshu. TURBIDIMETRIC DETERMINATION OF MICROAMOUNTS OF CHLORIDE(AS AgCl)IN COPPER ELECTROPLATING SOLUTION[J]. Physical Testing and Chemical Analysis Part B:Chemical Analgsis, 2000, 36(6): 257-258,260 |
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| Authors: | Zhang Ming wang Deshu |
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| Affiliation: | Zhang Ming,wang Deshu;((The Tongling Municipal Environmental Monitoring Station Tongling 244000)) |
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| Abstract: | It is reported in this paper that microamounts of chloride in copper electroplating solution can be determined directly by the turbidimetric method (as AgCl) in the presence of the major component, Cu 2 ion. The optimum conditions and interferences of the determination are also studied. The recoveries of the method are found to be in the range 98.7%~107.0% with RSD between 2.7%~8.8%. The method is simple and rapid. |
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| Keywords: | Chloride ion Silver chloride Turbidimetry Electroplating solution Copper foil Copper foi| |
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