Uniaxial tensile tests and dynamic mechanical analysis of satin weave reinforced epoxy shape memory polymer composite |
| |
| Institution: | 1. Space Structures Research Center, Shanghai Jiao Tong University, Shanghai 200240, China;2. State Key Laboratory of Ocean Engineering, Shanghai 200240, China;3. Collaborative Innovation Center for Advanced Ship and Deep-Sea Exploration, Shanghai 200240, China;4. Aerospace System Engineering Shanghai, Shanghai, 201108, China;1. International and Inter University Centre for Nanoscience and Nanotechnology, Mahatma Gandhi University, Kottayam, Kerala 686560, India;2. School of Chemical Sciences, Mahatma Gandhi University, Kottayam, Kerala 686560, India;3. Department of Physics, Birla Institute of Technology & Science, Pilani, Hyderabad 500078, India;4. Normandie Univ, UNIROUEN Normandie, INSA Rouen, CNRS, Groupe de Physique des Matériaux, 76000 Rouen, France;5. Department of Soil, Plant and Food Sciences, University of Bari “Aldo Moro”, Via Amendola 165/A, 70126 Bari, Italy;6. School of Pure and Applied Physics, Mahatma Gandhi University, Kottayam, Kerala 686560, India;1. LabMAT, Department of Civil and Environmental Engineering, University of Bío-Bío, 4051381 Concepción, Chile;2. Department of Mechanical Engineering, University of the Basque Country, 48013 Bilbao, Spain;1. School of Engineering, Trinity College Dublin, College Green, Dublin 2, Ireland;2. Centre for Innovative Human Systems, Trinity College Dublin, College Green, Dublin 2, Ireland |
| |
| Abstract: | The utilization of epoxy shape memory polymer composite (SMPCs) as engineering materials for deployable structures has attracted considerable attention in recent decades due to high strength and satisfactory stiffness in comparison with shape memory polymers (SMPs). Knowledge of static and dynamic mechanical properties is essential for analyzing structural behavior and recovery properties, especially for new epoxy SMPCs. In this paper, a new weave reinforced epoxy shape memory polymer composite was prepared with satin weave technique and resin transfer molding technique. Uniaxial tensile tests and dynamic mechanical analysis were carried out to obtain basic mechanical properties and glass transition temperatures, respectively.The tensile strength and breaking elongation of warp specimens were comparable with those of weft specimens. The increment of elastic modulus and hysteresis loop areas became smaller with loading cycles, meaning that cyclic tests could obtain approximate stable mechanical properties. For dynamic mechanical properties, glass transition temperature (Tg) obtained from storage modulus curves was lower than that determined from tan delta curves and Tgs in the warp and weft directions were similar (29.4 °C vs 29.7 °C). Moreover, the storage modulus in response to Tg was two orders of magnitude less than that with respect to low temperature, which demonstrated the easy processibility of epoxy SMPCs near glass transition temperature. In general, this study could provide useful observations and basic mechanical properties of new epoxy SMPCs. |
| |
| Keywords: | Deployable structures Dynamic mechanical analysis Elastic modulus Epoxy shape memory polymer composite Glass transition temperature Mechanical properties |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
