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Effect of local microstructure on the indentation induced damage of a fiber reinforced composite
Affiliation:1. Fiber and Polymer Science Program, Department of Textile Engineering, Chemistry, and Science, College of Textiles, North Carolina State University, Raleigh, NC 27695, USA;2. Statistics Ph.D. Program, Department of Statistics, College of Sciences, Raleigh, NC 27695, USA;3. Textile Chemistry Program, Department of Textile Engineering, Chemistry and Science, College of Textiles, North Carolina State University, Raleigh, NC 27606, USA;1. Polymer Division, School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Pulau Pinang, Malaysia;2. On Study Leave from Faculty of Applied Sciences, Universiti Teknologi MARA, 02600 Arau, Perlis, Malaysia;1. Department of Civil Engineering and Architecture, University of Catania, Italy;2. Department of Electrical, Electronics, and Informatics Engineering, University of Catania, Viale A. Doria, 6-95125 Catania, Italy
Abstract:Multicycle grid nanoindentation tests, combined with high resolution Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy (SPM) observations, were applied on a commercial Carbon Fiber (CF) reinforced epoxy matrix composite in order to study the induced damage mechanisms with respect to: (a) the orientation of the CFs relative to the surface and (b) the CF packing density. Normal to the surface CFs showed a multiple cracking pattern, those forming 45° showed distinct cracking, while CFs parallel to the surface did not suffer cracking. CF detachment from the epoxy matrix was observed in all cases. Pop-in type discontinuities were observed only in the samples where cracking ensued, as revealed through SEM and SPM observations. The load to induce CF cracking increased with increase of the matrix pocket area. Elastic modulus, hardness and significance of elastic deformation as an indentation energy absorbing mechanism, were reduced right after pop-in.
Keywords:Carbon fibres  Polymer-matrix composites (PMCs)  Debonding  Interface/Interphase
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