铜焊盘与锡合金焊点界面物相分析及可靠性探讨

Sn60Pb40焊料与铜焊盘的焊接界面中金属间化合物Cu6Sn5的形成与长大以及在热循环过程中的组织粗化是影响焊点可靠性的重要因素。作者根据SMT工艺的实际情况，使用Au—Sn共晶焊料、Sn60Pb40焊料分别涂覆在铜合金基板表面，并分别在320℃、240℃下保温1min，冷却形成焊点，利用X射线研究分析了两种不同焊盘基材与Sn60Pb40钎料、Au—Sn共晶钎料的钎焊界面的物相。运用经典相变理论、低周疲劳失效的机理以及“柯肯达尔”效应，就优异焊点的形成、物相产生、温度循环后组织粗化与增加Ni阻挡层，对提高焊接接点的温度循环可靠性的作用进行了分析与探讨。

Study on Phase Analysis and Reliability of the Interfaces Between Solder and Copper or Its Alloy

It was the formation and growth of Cu_6Sn_5 intermetallics at the interfaces of Sn60Pb40 solder and copper or brass w(copper) 62 % plate,and the coarsing of the microstructure during the heating cycle that were the important factors affecting the reliability of the soldering spots.Depending on the practical technique of SMT,the soldering spots were produced by using Au-Sn eutectic alloy and Sn60Pb40 solder,at a temperature of 320 and 240 maintained for 1 min respectively.On the basis of the theory of phase transformation and mechanism of low-cycle fatigue failure,the influences of the formation of excellent soldering spots,phase transformation,coarsing of microstructure after the heating cycle and barrier layer of Ni on improving the reliability of the soldering spots in the heating cycle were discussed.