| 提高硅光电探测器树脂封装可靠性研究 |
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| 引用本文： | 孙衍人,林言方.提高硅光电探测器树脂封装可靠性研究[J].浙江大学学报(理学版),1989,16(2):168-172. |
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| 作者姓名： | 孙衍人 林言方 |
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| 作者单位： | 杭州大学物理学系
(孙衍人，林言方)，肖山无线电厂(陈华平) |
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| 摘 要： | 树脂封装能缩小器件尺寸、减轻重量、降低成本、促进小型化。但它的可靠性,特别足抗潮湿性差。本文通过抗潮湿性能分析,比较了几种树脂封装,发现用F S203 C十G N522封装可提高其可靠性。
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| 关 键 词： | 树脂封装 抗潮湿性 可靠性 |
Enhancement of Resin Package Reliability on Silicon Photodetector |
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| Sun Yanren,Lin Yanfang,Chen Huaping.Enhancement of Resin Package Reliability on Silicon Photodetector[J].Journal of Zhejiang University(Sciences Edition),1989,16(2):168-172. |
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| Authors: | Sun Yanren Lin Yanfang Chen Huaping |
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| Institution: | Department of Physics |
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| Abstract: | Resin package is be used to decrease size of device, diminish weight, reduce costs and push for miniature. Yet, its reliability and anti-moisture permeability, in particular, is far from adequate. This paper has made a careful study of the ability to anti-moisture permeability by comparing quite a few methods of resin package, we have come to the conclusion that the use of FS203C+GN522 can enhance the reliability. |
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| Keywords: | resin package anti-moisture permeability reliability |
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