Facet degradation of high-power diode laser arrays |
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Authors: | JW Tomm E Thamm A Bärwolff T Elsaesser J Luft M Baeumler S Mueller W Jantz I Rechenberg G Erbert |
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Institution: | Max-Born-Institut für Nichtlineare Optik und Kurzzeitspektroskopie, Max-Born-Str. 2A, 12489 Berlin, Germany (Fax: +49-30/6392-1459, E-mail: tomm@mbi-berlin.de), DE OSRAM Opto Semiconductors, Wernerwerksstr. 2, 93049 Regensburg, Germany, DE Fraunhofer Institut für Angewandte Festk?rperphysik, Tullastr. 72, 79108 Freiburg, Germany, DE Ferdinand-Braun-Institut für H?chstfrequenztechnik, Albert-Einstein-Strasse 11, 12489 Berlin, Germany, DE
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Abstract: | Micro-Raman facet temperatures of high-power diode lasers with different waveguide architectures are compared. For regular
operation conditions, the thermal behavior of ‘unaged’ arrays emitting in the 808-nm wavelength region with different architectures
is similar, however, with an increased load thermal behaviors differ significantly and exhibit failure events at facet temperatures
typically between 150 and 450 °C. From various experiments, among them facet temperature measurements for ultrahigh-power
operation as well as by preparative failure analytics, we provide evidence that in arrays the front facets are significantly
affected by device operation and influence the failure behavior of the whole high-power diode laser also in cases when the
device failure is accompanied by dislocation creation inside the device.
Received: 3 October 1999 / Accepted: 9 November 1999 / Published online: 8 March 2000 |
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Keywords: | PACS: 42 55 P 68 60 D 78 30 F |
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