| 三维微流道系统技术研究 |
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| 引用本文： | 沐方清,张杨飞.三维微流道系统技术研究[J].中国电子科学研究院学报,2011,6(1):20-23. |
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| 作者姓名： | 沐方清 张杨飞 |
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| 作者单位： | 1. 中国电子科技集团公司第43研究所,合肥,230022
2. 北京大学,北京,100871 |
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| 摘 要： | 采用LTCC技术,可以获得替代采用硅或其他技术制作的微功能结构,简化工艺,降低成本.重点研究了内嵌三维(3D)微流道系统LTCC多层基板成型中的关键技术:热压和烧结,并进行工艺优化.利用优化的热压、烧结工艺参数,可制备出完好的3D微流道系统LTCC多层基板;通过实验验证,LTCC内嵌三维微流道系统取得了良好的散热效果.
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| 关 键 词： | LTCC 三维微流道 热压 烧结 散热 |
Technical Research of 3D Micro-channel System |
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| MU Fang-qing,ZHANG Yang-fei.Technical Research of 3D Micro-channel System[J].Journal of China Academy of Electronics and Information Technology,2011,6(1):20-23. |
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| Authors: | MU Fang-qing ZHANG Yang-fei |
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| Institution: | MU Fang-qing1,ZHANG Yang-fei2(1.The 43th Research Institute of CETC,Hefei 230022,China,2.Peking University,Beijing 100871,China) |
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| Abstract: | The micro-functional structure is fabricated by the LTCC technology instead of the silicon and other technology,which can simplify the process and reduce the cost.The critical manufacturing techniques of LTCC multi-layer substrate with micro-channel system embedded: lamination and sintering are studied mainly,and the processes are optimized.The intact LTCC substrate with the micro-channel system embedded can be fabricated precisely using the optimized lamination and sintering process parameters,and the good... |
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| Keywords: | LTCC 3D micro-channel lamination sintering heat dissipation |
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