Nitridation of thin SiO2 films in N2 and NH3 plasmas

A low-temperature (700°C) plasma-enhanced nitridation process which improves the dielectric breakdown of thin silicon dioxide (SiO₂) layers is presented. It uses a new, production compatible, parallel plate plasma reactor working at low RF frequencies. Nitrided oxides produce less charge trapping under high field stress, higher breakdown charge and a tighter distribution of breakdown fields than pure SiO₂. More nitrogen is incorporated in films treated in a NH₃ plasma than in a N₂ plasma. However, the latter present better electrical properties.