| Abstract: | A novel method for the preparation of ultrathin films of aromatic polyimides was developed through vapor deposition polymerization from combinations of monomer pairs of either N,N′-bis (trimethylsilyl)-substituted aromatic diamines and pyromellitic dianhydride or aromatic diamines and pyromellitic dithioanhydride. Both diamine component and tetracarboxylic dianhydride component were evaporated simultaneously at a stoichiometric molar ratio under vacuum, giving a deposited film on a substrate, which consisted of a polyamic acid derivative formed by the ring-opening polyaddition. The deposit was then converted to polyimide by thermal imidization at a relatively lower temperature, compared with a conventional method using the parent diamine and tetracarboxylic dianhydride. The properties of polyimide ultrathin films such as thermal stability, chemical resistance, and dielectric behavior were almost the same as those of the polyimide films prepared by a conventional method. |
