| SMT工艺技术要点和缺陷的处理 |
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| 引用本文： | 齐成.SMT工艺技术要点和缺陷的处理[J].印制电路信息,2011(8):62-67. |
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| 作者姓名： | 齐成 |
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| 作者单位： | 福建福州,350012 |
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| 摘 要： | 随着线路板组装向高密度、高精度、小体积、轻重量方向发展,电子装联技术已成为印制线路板生产首选的表面装贴技术。文章主要探讨电子装联各工艺技术要点和一些故障的处理。
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| 关 键 词： | 电子装联 印制线路板 工艺技术 故障处理 |
SMT process technology key points and defect treatment |
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| QI Cheng.SMT process technology key points and defect treatment[J].Printed Circuit Information,2011(8):62-67. |
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| Authors: | QI Cheng |
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| Institution: | 福建福州,350012 |
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| Abstract: | With PCB assembly developing towards high density,high precision,small size and light weight,SMT is main choice for PCB assembly.This paper discussed the process technology key points and defects treatment. |
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| Keywords: | Surface mounted technology Printed circuit board Process technology Break down |
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