微波多芯片组件中微量导电胶分配技术探讨

文章首先介绍了微波多芯片组件两种常见的封装结构形式及导电胶自动分配技术需求,并对接触式和无接触式导电胶点胶技术进行了论述,分析了它们各自的优缺点并对各项点胶参数进行了对比。然后,阐述了计量管式接触点胶技术以及需要研究的针头漏胶、点胶间隙确定以及基板表面状态对胶滴的影响三方面内容。紧接着阐述喷射式非接触点胶技术以及需要研究的空气阻力造成的胶滴飞溅问题。最后,提出计量管式接触点胶技术最适合腔体结构微波多芯片组件自动点胶。

Discussion on the Trace Conductive Adhesive Automatic Distribute in Microwave Multi-chip Module

First introduced two common microwave multichip module package structure and the need of automatically assigned conductive adhesive technology, then discussed both of contact and non contact dispensing conductive adhesive technology, and compared their advantages and disadvantages of the various points dispensing parameters. Then expounded metering tube in contact dispensing technology and the need to study three aspects of the needle leak adhesive, dispensing gap identified, and the substrate surface state influence on the gum drops, followed by elaborate noncontact jet dispensing technology and the need to study the air resistance caused by gum drops spattering. Finally, metered dispensing tube automatically dispensing is the best way for cavity structure microwave multi chip module.