Effect of the conditions of formation of glued joints on their thermophysical properties

A correlation has been experimentally established between the thermal resistance of adhesive films and the internal stresses that develop during the curing process. During cure the thermal resistance varies in parallel with the internal stresses. It is assumed that the development of thermal resistance is determined by the tension produced in the film by the development of the internal stresses.Voronezh Forest Engineering Institute. Translated from Mekhanika Polimerov, No. 4, pp. 754–756, July–August, 1973.