Institut Matematyki i Fizyki, Akademia Techniczno-Rolnicza w Bydgoszczy, ul. Kaliskiego 7, 85-791, Bydgoszcz, Poland
Abstract:
The diffusion process of copper through grain boundaries of 500 nm thick ion-plated Ag-12at%Sn films was studied in the temperature range 100–250°C. The method is based on the determination of the time of first appearance of Cu on the Ag---Sn surface using Auger electron spectroscopy for determining trace amounts of Cu. An activation energy of Ea = 0.53 eV and a diffusivity of D′o = 1.3 × 10?7cm2s?1 was obtained. For comparison, diffusion studies of Cu through ion-plated pure Ag layers have been performed. In this case an activation energy of Ea = 0.68 eV and a diffusivity of D′o = 2.3 × 10?5cm2s?1 have been found.