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Trace metal analysis on hafnium silicate deposited Si wafer by Total Reflection X-ray Fluorescence
Authors:Hikari Takahara  Hiroyuki Murakami  Toru Kinashi  Chris Sparks
Institution:1. Technos Co., Ltd., 1-31-1, Nagao-Tanimachi, Hirakata, Osaka 573-0164, Japan;2. ATDF, 2706 Montopolis Drive, Austin, Texas 78741, USA
Abstract:Hafnium silicate is a so-called high-k material, which is a new key material in the semiconductor field. This material is difficult to analyze by a conventional W-Lβ1TXRF source due to the high background originating from Hf-Lα lines. In this paper, the capability of Ir source TXRF analysis on hafnium silicate films is investigated with intentional contamination of Ti, Cr, Fe, Ni and Cu elements. The spectral fitting is discussed where X-ray resonant Raman scattering and escape peak of Ir-Lα overlap with Ni-Kα peak. The detection limits are estimated to 0.9 × 1010 to 2 × 1010 atoms/cm2 for the transition metals.
Keywords:Total reflection X-ray fluorescence  Trace metal analysis  Ir tube anode  High-k  Hafnium silicate
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