Thermal properties of multilayer graphene and hBN reinforced copper matrix composites

The unique properties of graphene make it a very attractive application, although there are still no commercial products in which graphene would play a key role. Good thermal conductivity is undoubtedly one of the attributes which can be easily used both in materials involving large monoatomic layers, that are very difficult to obtain, as well as multilayer graphene flakes, which have been commercially available on the market for several years. The article presents the results of tests on the characteristic thermal properties of composites with the addition of 2–15% of multilayer graphene (MLG) crystals. The motivation of the study was literature reports showing the possibility of increasing the thermal conductivity of composites with MLG participation in the copper matrix. Since the production of composites with increased properties is associated with obtaining a strong orientation of the flakes in the structure, composites with hBN flakes exhibiting significantly worse but also directional thermal properties were produced for comparison. The paper showed a strong influence of flake morphology on the possibility of creating a directional structure. The obtained Cu/MLG composites with the addition of only 2% MLG were characterized by an increase in the thermal conductivity coefficient of about 30% in relation to sinters without the participation of MLG.