Characterization of silicon layers epitaxially grown on metallurgical-grade polycrystalline substrates

The structural and electrical properties of silicon layers epitaxially grown on metallurgical-grade polycrystalline silicon substrates are examined to clarify the effect of grain boundaries, crystal defects and impurities in the substrates. Chemical etching of the epitaxial layer reveals that all the grain boundaries continue from the substrate into the epitaxial layer, whereas lines of high density etch pits do not always continue. The polycrystalline thin film solar cells are fabricated on the metallurgical-grade silicon substrates by successive deposition of p and n⁺ layers. These cells show short circuit current densities around 70% of that of the conventional single crystal cell. This reduction of the short circuit current is caused mainly by the short minority carrier diffusion length in the grains probably due to impurities involved in the epitaxial layers. The origins of such impurities are discussed by considering autodoping and solid-state diffusion from the substrate during growth of epitaxial layers.