Preparation of Ge-Si epitaxial alloys by sputtering

Ge-Si alloy layers have been epitaxially grown throughout the whole range of composition onto Ge substrates by the simultaneous getter sputtering from elemental Ge and Si sources. The epitaxial temperature was 550 to 830° C at growth rates of about 1 μm/h, depending on the Si atomic fraction in the range of 0.05 to 0.88. As the Si content in the alloy increases, the crystallinity of the layer decreases: Si-rich alloy layers contained microtwins. Hall measurements of alloy layers without intentional doping indicated p-type conductivity with Hall mobility of 600 cm²/V·sec at carrier concentration of 2 × 10¹⁶ cm^-3 for 25 at% Si in the alloy at room temperature. The observed temperature dependence of the hole mobility is indicative of alloy scattering.