In-process monitoring and control of doping gas concentration during vapor phase silicon epitaxial growth by using a flame photometric detector

An in-process monitoring and control method of the doping gas concentration during epitaxial growth of Si was developed. A flame photometric detector (FPD) can be used as a monitor for the PH₃ and B₂H₆ dopant concentrations in the injected doping gases. A combination of this dopant monitor with an automatic control system of the silicon source (SiHCl₃) gas concentration using an infrared spectrophotometer as a monitor, makes possible an automatic in-process control of the concentrations of dopant and of silicon source gas supplied to the reactor. The present system provides an accurate and reproducible control of impurity concentrations in Si epitaxial layers. Good correlation between the monitored signal (or the doping gas concentration) and the impurity concentration incorporated into the growth layers was confirmed for PH₃ (n-type) and B₂H₆ (p-type) doping. For the B₂H₆ doping, a divergence from the linear relationship between the doping gas concentration and the impurity concentration in the layers was observed in the level of acceptor concentration below about 10¹⁵ atoms/cm³. The transient response of the present system was measured by growing epitaxial layers with increasing and decreasing step-changes in the dopant gas flow during continuous deposition of the layers. Some interesting, but complicated, transient responses of impurity concentration in the growth layer were observed. The responses are different between the PH₃ doping and the B₂H₆ doping, and also different between increasing and decreasing steps especially for the B₂H₆ doping.