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An improved terramechanics model for a robotic soil surface sampler
Institution:1. School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China;2. School of Engineering, Nanjing Agricultural University, Nanjing 210031, China;1. Mechanical Engineering, University of Alberta, Edmonton, AB, Canada;2. Civil and Environmental Engineering, University of Alberta, Edmonton, AB, Canada;3. Computing Science, University of Alberta, Edmonton, AB, Canada;1. Department of Automotive, Mechanical and Manufacturing Engineering, University of Ontario Institute of Technology, ON L1H 7K4, Canada;2. Volvo Group Trucks Technology, Vehicle Analysis Dept. BF72920, Göteborg AB4S 405 08, Sweden;1. Department of Aerospace Engineering, Tohoku University, 6-6-01 Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 9808579, Japan;2. Department of Department of Mechanical and Control Engineering, Kyushu Institute of Technology, 1-1 Sensuicho, Tobata-ku, Kitakyushu, Fukuoka 8048550, Japan
Abstract:Robotic systems have been developed and deployed for sample collection and geotechnical measurements of soil characteristics. A custom scoop-type robotic soil sampler has been designed and built for sampling operations. An earlier terramechanics model for scoop samplers proposed by Mori et al. is limited to describing the interaction forces in loose sands. This paper proposes an extended model which captures the interaction of a scoop-type sampler with a wider range of soils, including cohesive and adhesive mediums, and accounts for the effects of surcharge. The proposed model was compared to the Mori model in both simulation and laboratory experiments. The forces predicted by each model agree closely for loose sand, but differ in cohesive and adhesive mediums. The proposed model was experimentally tested on dry sand and on centrifuged tailings, a cohesive and adhesive soil. In both cases, the proposed model showed close agreement between measured and predicted forces.
Keywords:Excavation  Robotic  Sampler  Environmental monitoring  Scoop
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