Nanoscale surface roughness characterization by full field polarized light-scattering |
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Authors: | Cheng-Yang LiuWei-En Fu Tzeng-Yow LinChi-Sheng Chang Jay-San Chen |
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Institution: | a Department of Mechanical and Electro-Mechanical Engineering, Tamkang University, Taipei County, Taiwan b Center for Measurement Standards, Industrial Technology Research Institute, Hsinchu, Taiwan c Bureau of Standards, Metrology and Inspection, Taipei, Taiwan |
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Abstract: | Characterizing surface roughness in nanoscale nondestructively is an urgent need for semiconductor and wafer manufacturing industries. To meet the need, an optical scatter instrument in bidirectional ellipsometry has been developed for characterizing nanoscale surface roughness, in particular, on the wafers after chemical-mechanical polishing. The polarized angular dependence of out-of-plane light-scattering from nanoscale surface roughness is analyzed and characterized. These analysis and characterization results show strong correlations of surface roughness and angular dependence of bidirectional ellipsometric parameters for full field light-scattering. The experimental findings prove good agreement with theoretical predictions for different surface roughnesses. As a result, the nanoscale surface roughness can be accurately measured and characterized by the angular dependence and the polarization of light scattered from surface. |
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Keywords: | Bidirectional ellipsometry Roughness Light-scattering measurement |
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