光纤光栅边孔封装技术

提出了一种新型的光纤光栅压力增敏封装技术——边孔封装技术,它通过改变封装体的几何结构实现了高倍数的压力增敏效果,较大程度减小了压力增敏倍数对聚合物材料参量的依赖性。采用有限元理论建立了边孔封装结构的压力传感模型,分析了封装体几何结构变化对封装后压力灵敏度的影响。采用聚合物材料进行了封装制作实验,测量结果表明封装后光纤光栅的压力灵敏度为5251 pm/MPa,是封装前压力灵敏度的1750倍,并将交叉敏感问题改善了近三个数量级,可满足高精度水下压力测量的应用要求。

Research on Fiber Bragg Grating Side-Hole Package Technology

The side-hole package technology,a novel fiber grating pressure sensitivity enhancing scheme,is presented.The pressure sensitivity is improved several orders using side-hole package technology,which has reduced the dependence of pressure sensitivity on polymer material parameters through changing package structure.The pressure-sensing model of side-hole package is built using the finite element method and the influence of package geometric configuration on pressure sensitivity is analyzed.The experimentally measured results show that the pressure sensitivity of fiber grating with side-hole package is 5251 pm/MPa,which is 1750 times that of without package.The cross-sensing problem is suppressed by three orders and the sensor can satisfy underwater pressure measurement with high accuracy.