Thermal stress analysis for polyimide thin film: The effect of solvent evaporation

We propose a stress model to account for the thermal stress caused by a mismatch of isobaric expansivity, solvent evaporation, and imidization. The evaporation strain term is given as functions of a viscosity, and solvent weight fraction. The proposed model is in very good agreement with experimental data and gives useful information about the analysis of the thermal stress caused in polymeric films.