| 大功率LED封装界面材料的热分析 |
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| 引用本文： | 齐昆,陈旭.大功率LED封装界面材料的热分析[J].电子与封装,2007,7(6):8-12,48. |
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| 作者姓名： | 齐昆 陈旭 |
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| 作者单位： | 天津大学化工学院,天津,300072;天津大学化工学院,天津,300072 |
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| 基金项目： | 国家杰出青年基金-海外青年学者合作基金
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高等学校学科创新引智计划 |
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| 摘 要： | 基于简单的大功率LED器件的封装结构,利用ANSYS有限元分析软件进行了热分析,比较了四种不同界面材料LED封装结构的温度场分布。同时对纳米银焊膏低温烧结和Sn63Pb37连接时的热应力分布进行了对比,得出纳米银焊膏低温烧结粘接有着更好的热机械性能。
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| 关 键 词： | 大功率LED 界面材料 热分析 热应力 纳米银焊膏低温烧结 |
| 文章编号： | 1681-1070（2007）06-0008-05 |
| 修稿时间： | 2006-12-28 |
Thermal Analysis of Interface Materials in High-power Light-emitting Diode Packages |
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| QI Kun,CHEN Xu.Thermal Analysis of Interface Materials in High-power Light-emitting Diode Packages[J].Electronics & Packaging,2007,7(6):8-12,48. |
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| Authors: | QI Kun CHEN Xu |
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| Institution: | School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China |
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| Abstract: | Based on a simple-structure package, thermal analysis with ANSYS software for high-power LED was presented. Temperature fields of different interface materials were compared. Compared with thermal stresses fields of low-temperature nanosilver sintered paste and Sn63Pb37 interface materials. The result showed that the novel low-temperature nanosilver sintering technology had better thermomechanical properties. |
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| Keywords: | high-power LED interface materials thermal analysis thermal stress low-temperature nanosilver sintering |
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