Online monitoring of thermoset post-curing by dynamic mechanical thermal analysis DMTA |
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| Authors: | W Stark H Goering U Michel H Bayerl |
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| Institution: | 1. Federal Institute for Materials Research and Testing, BAM, Department VI.3, Unter den Eichen 87, D-12205 Berlin, Federal Republic of Germany;2. University of Applied Science Aalen, Beethovenstraße 1, D-73430 Aalen, Federal Republic of Germany;3. Hexion Specialty Chemicals GmbH, Gennaer Straße 2-4, D-58642 Iserlohn–Letmathe, Federal Republic of Germany |
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| Abstract: | Thermosetting moulding compounds are synthetic materials which can be easily formed in the molten state and achieve high temperature stability due to a cross-linking process which takes place during manufacture. To ensure thermal and mechanical properties, post-curing of moulded phenolic resin components is necessary for high quality applications. In the industrial practice, post-curing time–temperature-programs are heuristically acquired. In this paper, dynamical mechanical thermal analysis is employed to determine optimal post-curing conditions for injection moulded parts from phenolic resin. |
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