Polyethylene glycol in copper electrodeposition onto a rotating disk electrode

Many of the proprietary additive formulations that have been proposed to control the properties of metal electrodeposits include water soluble macromolecules. Among these are the hydrodynamically interesting polyethylene glycols ‘Polyox’. In the course of a rotating disk electrode study of the effects of additives in copper electrodeposition the present authors had cause to try the effects of low concentrations of Polyox in an acid copper sulphate plating solution. In the presence of an essential trace of chloride ion Polyox very strongly inhibited deposition below a critical overpotential at which current density rises extremely rapidly with increasing overpotential. These results suggest that below the critical overpotential chloride ions hold a film of Polyox onto the electrode surface and may also give the film some lateral cohesion. The film may be a Polyox-cuprous chloride complex. Striking spiral patterns form at the critical overpotential. Their characteristics are explained as the consequences of electrodeposition on a surface containing submicroscopic protrusions and depressions in conditions where current density increases very rapidly with potential.