Hamilton体系下层合板弱粘接模型的应用

层合板的层间粘接模型对整个层合板的结构有重要影响．运用Hamilton正则方程对层合板层间的不同类型的粘接模型进行了分析．结合弹性材料修正后的Hellinger Reissner变分原理和插值函数，构建了直角坐标系下8节点层合板的每一层的线性方程；考虑到脱层板的连接界面处应力和位移的关系，改进了现有的常用弱粘接模型，建立不同粘接模型的控制方程；最后通过求解整个板的控制方程，得到层合板的层间应力和位移．数值算例验证了该模型的正确性，并研究了层间界面为线性和非线性时的问题．结果表明:应用改进后的弱粘接模型，能够更好地模拟层合板的弱界面失效过程．

Application of Composite Laminated Plates With Bonding Imperfection in Hamilton System

The weak interfacial bonding seriously affected the mechanical behavior of laminated plates. Different imperfect bonding models of laminated plates were discussed in Hamilton canonical equation. By combining the modified H R variational principle for elastic material with the quadratic interpolation functions, the linear formulation of laminated plates with 8 node for Hamilton canonical equation in the Cartesian coordinate was derived. The relationship between stress and displacement on the interface between layers was considered to improve the normal bonding model, and the state equation with delamination situation was established. The stress and displacement were obtained by solving the overall model. Numerical examples showed that the methods presented were correct, and this paper studied the linear and non linear bonding models of the laminated plate respectively. The last results show that the application of improved models can simulate the process of fail better.