Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters |
| |
| Affiliation: | 1. Beijing Engineering Research Center of Precision Measurement Technology and Instruments, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124, China;2. Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough LE11 3TU, UK;3. The Faculty of Engineering, University of Nottingham, University Park, Nottingham NG7 2RD, UK;1. Department of Mechanical Engineering, Oita University, Oita 870-1192, Japan;2. Structural Materials Division, Korea Institute of Materials Science, Changwon 642-831, Republic of Korea;3. Department of Materials Science & Engineering, ReCAPT, Gyeongsang National University, Chinju 660-701, Republic of Korea;5. Department of Metallurgy & Advanced Materials Engineering, Changwon National University, Changwon 641-773, Republic of Korea;1. Computing Department, Faculty of Arts, Computing and Creative Industry, Sultan Idris Education University (UPSI), 35900 Tanjong Malim, Perak, Malaysia;2. College of Engineering and Technology, University of Derby, Derby DE22 3AW, UK;3. Department of Mechanical Engineering, Mohammad Ali Jinnah University, Islamabad, Pakistan;4. Advanced Technovation Ltd., Loughborough Innovation Centre, Loughborough University Science & Enterprise Park (Holywell Park), Loughborough LE11 3AQ, UK;1. Department of Communicating Engineering, National Defense Academy, Yokosuka, Kanagawa 239-8686, Japan;2. Department of Materials Science and Engineering, Tokyo Institute of Technology, Yokohama 226-8503, Japan;3. Department of Materials, Physics and Energy Engineering, Nagoya University, Nagoya 464-8603, Japan;1. TU Bergakademie Freiberg, Institute of Materials Engineering, Gustav-Zeuner-Str. 5, 09599 Freiberg, Germany;2. TU Bergakademie Freiberg, Institute of Materials Science, Gustav-Zeuner-Str. 5, 09599 Freiberg, Germany;1. Department of Materials Science and Engineering, Korea University, 1-5 Ga, Anam-Dong, Seongbuk-Gu, Seoul 136-701, Korea;2. Information Technology-Nano Science, KU-KIST Graduate School of Converging Science and Technology, 1-5 Ga, Anam-Dong, Seongbuk-Gu, Seoul 136-713, Korea;3. Thin Film Materials Research Center, Korea Institute of Science and Technology, 39-1, Hawolgok-Dong, Seongbuk-Gu, Seoul 136-791, Korea;1. Research Center in Industrial Technologies CRTI, P.O. Box 64, Cheraga 16014, Algiers, Algeria;2. Laboratory of Environmental Engineering, Badji Mokhtar University, Annaba, Algeria;3. Laboratoire Croissance et Caractérisation de Nouveaux Semi-Conducteurs, Université Ferhat Abbas, Sétif-1, Algeria;4. Laboratory of Electrochemistry and Corrosion, Polytechnic Military School, Algiers, Algeria |
| |
| Abstract: | Glass is a promising substitute substrate material being evaluated for electronic packaging technology. Improving the electroless copper plated layer adhesion of the glass is one of the most important considerations for development of the technology. An excimer laser (248 nm) was used for structured texturing of glass surfaces (to improve adhesion) by changing mask dimensions, laser operating parameters and overlapping pitch spacing, and therefore producing a range of micro-scale features. Electroless plated copper adhesion strength was assessed using quantitative scratch testing, demonstrating that micro-patterned structures can significantly improve copper/glass adhesion. New ISO 25178 Part 2 areal surface texture parameters were used to characterise the surface roughness of ablated glass surfaces, and correlated to the scratch testing results. Highly correlated parameters were identified that could be used as predictive surface design tools, directly linking surface topography to adhesion performance, without the need for destructive adhesion quantification via scratch testing. |
| |
| Keywords: | Excimer laser Glass Micro-patterning Adhesion Areal parameters |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
