| 硅基梳齿式MEMS器件及封装的失效调查 |
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| 引用本文： | 蔡伟,林宙峰,李少平,恩云飞.硅基梳齿式MEMS器件及封装的失效调查[J].微电子学,2011,41(1). |
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| 作者姓名： | 蔡伟 林宙峰 李少平 恩云飞 |
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| 作者单位： | 1. 工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610
2. 工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610;华南理工大学材料科学与工程学院特种功能材料教育部重点实验室,广州,510640 |
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| 摘 要： | 对典型硅基梳齿式MEMS器件进行失效调查和分析,验证其主要失效模式,分析其失效机理.利用电子扫描显微镜(SEM),X射线透视系统、扫描声学显微镜(SAM),X射线能谱成份分析(EDX)、金相切片分析、封装气体分析及电性能测试等分析技术,发现在工艺制造中的机械失效是造成此类器件失效的主要原因.另外,此类器件的封装失效主要表现为气密性失效和装配工艺失效.
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| 关 键 词： | 微机电系统 封装 失效分析 失效模式 |
Investigation into Device and Package Failure of Silicon-Based MEMS with Comb Structure |
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| CAI Wei,LIN Zhoufeng,LI Shaoping,EN Yunfei.Investigation into Device and Package Failure of Silicon-Based MEMS with Comb Structure[J].Microelectronics,2011,41(1). |
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| Authors: | CAI Wei LIN Zhoufeng LI Shaoping EN Yunfei |
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| Institution: | CAI Wei1,LIN Zhoufeng1,2,LI Shaoping1,EN Yunfei1(1.National Key Laboratory for Reliability Physics and Its Application Technology of Electronic Component,China Electronic Product Reliability and Environmental Testing Research Institute,Guangzhou 510610,P.R.China,2.Key Laboratory of Special Function Materials under Ministry of Education,College of Materials Science and Engineering,South China University of Technology,Guangzhou 510640,P.R.China) |
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| Abstract: | Failures of a typical Si-based MEMS device with comb structure were investigated and localized.In addition,some novel failure styles were analyzed and determined,and their failure mechanisms were presented.By using SEM(Scanning Electron Microscopy),X-Ray Inspection System,SAM(Scan Acoustic Microscopy),failures in MEMS device and package were localized.By using EDX(Energy Dispersive X-ray spectroscopy),microsection inspection and analysis,package gas analysis and electrical test,failure modes were identified... |
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| Keywords: | MEMS Package Failure analysis Failure mode |
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