Digital speckle pattern interferometry applied to thermal strain measurements of metal- ceramic compounds |
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| Authors: | P Aswendt R Hfling W Totzauer |
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| Institution: | P. Aswendt, R. Höfling,W. Totzauer |
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| Abstract: | An experimental set-up is described for measuring two displacement components by digital speckle pattern interferometry (DSPI). Experimental results are given for metal-ceramic components under thermal stress. Emphasizing quantitative evaluation, the effective thermal expansion coefficient was determined. |
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| Keywords: | digital speckle pattern interferometry thermal expansion metal-ceramic components |
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