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Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application |
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| Authors: | Hong Wei-Jie Yuan Li-Li Zhang Hao-Yang Cui Chao Chen Wei Yang Shi-Yong |
| Affiliation: | 1.Key Laboratory of Science and Technology on High-tech Polymer Materials, Chinese Academy of Sciences, Beijing, 100190, China ;;2.School of Chemical Engineering, University of Chinese Academy of Sciences, Beijing, 100049, China ;;3.Astronautical Systems Engineering Technology, Beijing, 100076, China ;;4.Aerospace Research Institute of Materials & Processing Technology, Beijing, 100076, China ; |
| Abstract: | To meet the processing requirements of resin transfer moulding (RTM) technology,reactive diluent containing m-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-designed molecular weights of 1500-2500 g/mol derived from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA),3,4'-oxydianiline (3,4'-ODA) and m-phenylenediamine (m-PDA).This blend shows low minimum melting viscosity (＜1 Pa·s) and enlarged processing temperature window (260-361 ℃).FPI-R-1 stays below 1 Pa·s for 2 h at 270 ℃.The relationship between the molecular weight of the blend and its melting stability was first explored.Blending oligoimides with lower molecular weights exhibit better melting stability.Upon curing at 380 ℃ for 2 h,the thermosetting polyimide resin demonstrates superior heat resistance (Tg=420-426 ℃). |
| Keywords: | Oligoimide Resin transfer molding Reactive diluent Melting stability |
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