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High resistive ferrite films by a solution process for electromagnetic compatible (EMC) devices
Authors:AK Subramani  M Tada  M Yoshimura
Institution:a Materials and Structures Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta, Midori, Yokohama 226-8503, Japan
b NEC Tokin Corporation, 6-7-1 Koriyama, Taihaku-ku, Sendai, Miyagi 982-8510, Japan
c Department of Physical Electronics, Tokyo Institute of Technology, 2-12-1 ōokayama Meguro, Tokyo 152-8552, Japan
Abstract:Mn-Zn ferrite films with high resistivity and good noise suppressing ability for use as ‘coupling-type noise suppressors’ have been prepared by the spin-spray ferrite plating. The as-prepared films were crystalline and exhibited single-phase spinel structure. The films had an ‘integrated nano-columnar’ morphology that resulted in a very high resistivity. Further, by varying the chemical composition, films with varying resistivity were prepared and then heat treated at 260 °C for 3 min, similar to that of the reflow soldering process. The reflection and transmission coefficients, S11 and S21 parameters, on coplanar micro-strip line (50 Ω) were measured for the as-prepared and heat-treated films in order to study the effect of heat treatment. When the resistivity was above 2×105 Ω/sq, S11 and S21 exhibited uniform profiles throughout the measurement frequency (50 MHz-10 GHz), which is ideal for the ‘coupling-type’ noise suppressor. These films retain a moderately high resistivity and hence do not show the downshift in the stopband frequency even after the heat treatment (reflow soldering process).
Keywords:91  60  Pn  13  40  &minus  f  81  05  &minus  t  81  40  Rs  75  50  Gg
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