| 硬脆性材料线切割切削液的组成和发展 |
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| 引用本文： | 富扬,刘兆滨,宋恩军,边玉强,孙艳芝.硬脆性材料线切割切削液的组成和发展[J].半导体技术,2008,33(4):292-295. |
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| 作者姓名： | 富扬 刘兆滨 宋恩军 边玉强 孙艳芝 |
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| 作者单位： | 辽宁奥克化学股份有限公司,切削液事业部,辽宁,辽阳,111003;辽宁奥克化学股份有限公司,切削液事业部,辽宁,辽阳,111003;辽宁奥克化学股份有限公司,切削液事业部,辽宁,辽阳,111003;辽宁奥克化学股份有限公司,切削液事业部,辽宁,辽阳,111003;辽宁奥克化学股份有限公司,切削液事业部,辽宁,辽阳,111003 |
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| 基金项目： | 国家发展和改革委员会资助项目 |
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| 摘 要： | 综述了国内外太阳能光伏产业及半导体等高精端电子产业中硬脆性材料线切削液的发展、分类和应用.归纳总结了国内外近年来切削液的使用量,对2008年的市场需求进行了预测,重点分析综述了国内外水性切削液产品组成、配方的研究进程及切削液产品对线切割工艺过程、晶片质量的影响,并对国内线切削液今后的发展提出了建议.
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| 关 键 词： | 切削液 线切割 硬脆性材料 |
| 文章编号： | 1003-353X(2008)04-0292-04 |
| 修稿时间： | 2007年12月13 |
Composition and Development of Wire Cutting Fluids Used for Hard and Brittle Materials |
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| Fu Yang,Liu Zhaobin,Song Enjun,Bian Yuqiang,Sun Yanzhi.Composition and Development of Wire Cutting Fluids Used for Hard and Brittle Materials[J].Semiconductor Technology,2008,33(4):292-295. |
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| Authors: | Fu Yang Liu Zhaobin Song Enjun Bian Yuqiang Sun Yanzhi |
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| Institution: | Fu Yang,Liu Zhaobin,Song Enjun,Bian Yuqiang,Sun Yanzhi(Cutting Fluids Hi-Tech.Department,Liaoning Oxiranchem,Inc.,Liaoyang 111003,China) |
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| Abstract: | The development,sort and application of wire cutting fluids are summarized,which are used for cutting hard and brittle materials in the worldwide solar photovoltaic and semiconductor industries.The recent consume amounts of cutting fluids and the market requirement for 2008 is also forecasted.The composition and formulation of cutting fluids and the effects on wafer quality during manufacturing processing are analyzed.Some suggestions are proposed on the development of wire cutting fluids. |
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| Keywords: | cutting fluid wire cutting hard and brittle material |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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