Nanosecond and femtosecond excimer laser ablation of fused silica

Ablation of fused silica using standard excimer lasers (20–30 ns pulse duration at 193, 248, and 308 nm) and a short pulse laser system (500 fs at 248 nm) is reported. Ablation rates range from several hundred nm/pulse (193 nm or fs-laser) up to about 6 m/pulse (308 nm). The performance of the ablation is found to depend not only on wavelength and pulse duration but also on the existing or laser induced surface quality (e.g., roughness) of the material. Special ablation phenomena are observed. At 193 nm and moderate fluence (3 J/cm²) ablation takes place at the rear side of a plate without affecting the front side, whereas at higher fluence normal ablation at the front side occurs. At 248 nm (standard excimer) the existence of two consecutive ablation phases is observed: smooth ablation at low rate is followed by explosive ablation at high rate. Using fs-pulses smooth shaped holes are formed during the first pulses, whereas high pulse numbers cause the development of a ripple structure in the ablation craters.The results lead to the conclusion that two different ablation mechanisms are involved: the first is based on two photon bulk absorption, the second on controlled surface damage in relation with (partially laser induced) singularity conditions at the surface.Presented at LASERION '91, June 12–14, 1991, München (Germany)