A simple technique for determining yield strength of thin films

A technique to measure the yield strength of thin films has been developed which combines experimental observations of deflection and plastic deformation with finite element predictions of stress. This technique relies on integrated circuit technology to build bridge and cross beam test structures with a range of dimensions. Each structure is deflected in increments of 1 μm until the structure no longer elastically recovers upon release. In tandem with experimentally verified numerical predictions of force and stress, the yield strength of the thin film can be bounded between the highest elastic stress result and the lowest plastic stress result. For our test material of copper, this method provides a yield strength between 2.80 and 3.09 GPa, a value significantly larger than that for bulk copper, but consistent with thin film theory.