| 高层数刚挠性板工艺的研究 |
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| 引用本文： | 曾芳仔,易良江,谭永忠.高层数刚挠性板工艺的研究[J].印制电路信息,2006(6):48-49. |
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| 作者姓名： | 曾芳仔 易良江 谭永忠 |
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| 作者单位： | 1. 江南计算技术研究所,214083
2. 南京浦江电子公司 |
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| 摘 要： | 探讨了高层数刚挠板生产工艺中的几个关键技术,结合显微剖切讨论了刚挠板的可靠性。
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| 关 键 词： | 刚挠板 分层 可靠性 |
Study of the Processing of High-layer Rigid-flex Board |
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| Zeng Fangzai,Yi Liangjiang,Tan Yongzhong.Study of the Processing of High-layer Rigid-flex Board[J].Printed Circuit Information,2006(6):48-49. |
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| Authors: | Zeng Fangzai Yi Liangjiang Tan Yongzhong |
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| Institution: | Zeng Fangzai Yi Liangjiang Tan Yongzhong |
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| Abstract: | This article discussed several production technics of high-layer rigid-flex board and its reliability. |
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| Keywords: | rigid-flex board separation reliability |
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