Heat-conducting adhesives based on modified epoxy resins

Main characteristics of heat-conducting adhesive materials used to withdraw heat from warming elements of devices and the joints of electrotechnical equipment are presented. The developed materials, i.e., TsMK-TP adhesive pastes and TPK convenient for application adhesives, are cold-curing compositions based on epoxy-diane resins modified with Laproxide products. They have heat conductivity coefficients of no less than 1.8 W/(m K), are workable in the temperature range of −196 to 150°C (up to 200°C for a short period of time), and do not contaminate optical elements due to minimal gas release under exposure to vacuum and increased temperatures.