Intermetallic phase formation in electrochemical alloy deposition |
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Authors: | Fujiwara Yutaka Enomoto Hidehiko |
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Institution: | (1) Osaka Municipal Technical Research Institute, 1-6-50 Morinomiya, Joto-ku, 536-8553 Osaka , Japan |
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Abstract: | Three examples of the electrochemical deposition of intermetallic phases are shown. Electrodeposition of the single-phase ![beta](/content/j2tm4e0ybdxy63dt/xxlarge946.gif) -brass superlattice at underpotentials of Zn in Cu-Zn alloy plating is explained by an accumulative underpotential deposition (UPD) mechanism. Growth of the Cu-Sn intermetallic phase layer in the contact immersion deposition of Sn onto Cu is accounted for by a UPD/vertical solid-state diffusion mechanism. Ag3Sn formation in the Sn/Ag-nanoparticle composite plating is illustrated by atomic site exchange at the interface between the deposited Sn matrix and the occluded Ag nanoparticles. |
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Keywords: | Electrochemical deposition Intermetallic phases Site exchange Solid-state diffusion Underpotential deposition |
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