半导体激光器不同封装下的封装应力

为研究正装和倒装封装下高功率半导体激光器有源区的应力问题,利用有限元软件ANSYS分析得到了两种封装方式下应力场分布图及有源区平行于x轴路径上的应力变化曲线。模拟结果表明,与正装封装相比,倒装封装下有源区应力变化剧烈,平均值高出正装一个数量级。并通过荧光光谱实验对比了封装前后激光器芯片的波长变化,根据半导体禁带宽度与应变关系算出两种封装下的应力大小,与模拟值相符。通过模拟和实验结果可见,芯片封装形式对芯片引入的应力有显著的差别,倒装封装下芯片有源区应力远高于正装封装。

Package Stress of Different Semiconductor Lasers Packages

To analyze the package stresses of the up-mounted chip and down-mounted chip of the high power semiconductor laser,the finite element software ANSYS was applied to simulate the stress of different packages.Based on the stress fields and stress distributions on the path which was parallel with the the X axis on the active region,it was easily found that the down-mounted chip had a higher stress than the up-mounted chip.The wavelength was measured and analyzed using the electroluminescence.Package stress was calculated based on the relations between stress and band-gap energy,and it was consistent with that of the simulation method.The simulation and experiment results show that the induced stress different packages is distinctive from each other,and the down-mounted chip has a much higher stress than the up-mounted chip.