| 基于Multi-stage的double stitch工艺在铜线焊中的应用 |
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| 引用本文： | 刘文峰,齐立敏,柳青.基于Multi-stage的double stitch工艺在铜线焊中的应用[J].电子工业专用设备,2014(9):26-31. |
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| 作者姓名： | 刘文峰 齐立敏 柳青 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京,100176 |
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| 摘 要： | 作为引线键合工艺中传统的焊接材料,金线在稳定性、导电性及价格等方面存在诸多局限,使得铜线焊技术在IC封装领域得到越来越广泛的应用。同时,由于铜线易氧化、硬度高,焊接能力较低,特别是二焊点容易出现拉力不够、开裂等缺陷,使得铜线焊的应用受到限制。针对传统工艺流程,提出Multi-stage方法,并在此基础上实现二焊点的double stitch工艺方法,通过试验证明该方法能够有效提高二焊点拉力,增强焊接强度。
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| 关 键 词： | 铜线焊 分段式焊接(Multi-stage) 双鱼尾式焊点(Double stitch) |
Application of Double Stitch in Copper Wire Bonding Based on Multi-stage |
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| LIU Wenfeng,QILim in,LIU Qing.Application of Double Stitch in Copper Wire Bonding Based on Multi-stage[J].Equipment for Electronic Products Marufacturing,2014(9):26-31. |
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| Authors: | LIU Wenfeng QILim in LIU Qing |
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| Institution: | (The 45th Research Institute of CETC, Beijing, 100176, China) |
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| Abstract: | As the conventional bonding material,gold has been lim ited in advanced w ire packaging because of its stability,conductivity and the cost.As a result,the developm entand research of copper w ire is becom ing faster and faster in recentyears.Butatthe same time,the crack in 2nd bond ,such as low pullstrength and liftstitch are more likely to be observed in m anufacture due to itis oxidization ,high rigidity and the low bonding ability.This paper proposes a new double stitch m ethod based on Multi-stage,and then prove its superiority in increasing the pullstrength and bonding perform ance by the pulltestexperim ent. |
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| Keywords: | Copperw ire bonding Multi-stage Double stitch |
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