GaAs(100)解理面的能带弯曲

在真空中解理后，用XPS测得了GaAs样品（110）断面能带弯曲的动态过程．两组重掺杂n型和p型GaAs样品的费米能级分别向禁带中间的方向移动了0.4eV和0．3eV.实验测得重掺杂n型和p型GaAs样品费米能级之差为1．3eV，它们的禁带宽度理论值为1．42eV，这说明结果是合理的．根据实验结果，对引起GaAs表面能带弯曲的可能原因进行了分析讨论．排除了本征表面态、真空中残留气体和X射线辐射等原因，认为解理过程在表面产生的缺陷和解理后表面晶格弛豫过程中产生的缺陷可能是导致能带弯曲的主要原因．

Band Bending of Cleaved GaAs(110) Surface

After cleaved in UHV, the dynamic band bending of GaAs(110) surface was investigated using in situ XPS measurement. It was found that the Fermi level of heavy doped n-GaAs and p-GaAs shifted to the midgap 0. 4 eV and 0. 3 eV, respectively. Fermi level difference of 1. 3eV between heavy doped n-GaAs and p-GaAs was revealed. In fact, the theoretical band gaP of GaAs is 1. 42 eV, which suggests that our experimental results should be believable. Based on the experimental results, it was concluded that the surface band bending was caused neither by intrinsic surface states in GaAs, the residual gas in UHV, nor the X-ray radiation. The band bending should be caused mainly by the surface defects induced during the cleavage and more Probably during lattice relaxation.