| Abstract: | A homogeneous melting eutectic Au/Sn solder bump for laser chip application has been developed. The under‐bump metallization consists of a Ni wetting layer, a plating seed layer of Pt/Au/Ti multi‐layer scheme. The solder is electroplated as a sequence of Ni, Au and Sn layers. The bump can be exposed to multi‐step reflow cycles. The reflow of the solder as plated starts with a phase forming process in the solid state which results in an eutectic‐like phase and the near eutectic dand z phases. The dand z phases dissolve during the liquid state stage of the reflow at temperatures between 300 and 350 °C. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim) |
