像元间距为25μm、160×120元无热电制冷器的非致冷非晶硅探测器（英文）

介绍用非晶硅微型辐射热量计制成的160×120元非致冷红外焦平面阵列的特点和性能，该阵列集成在一个无铅芯片载体封装中，像素间距为25μm，适合于大批量生产。 25μm像元结构得益于较小的热时间常数，该技术使我们能够设计出更高的热隔离性能，从而能以35μm技术为基础开发出25μm技术。通过采用新的像素设计和更进一步推动设计方法，在没有采用复杂昂贵的双层结构的前提下，保持了较高填充因子。从读出集成电路结构、封装、可操作性和光电性能入手对该探测器进行了介绍。为该探测器设计了一种新型集成读出电路。可以通过串行链接对增益、图像翻转和积分时间等高级功能进行操控，降低电气对接的数量。研制的小型无铅芯片载体封装便于大规模生产探测器，主要用途为便携式摄像机或头盔摄像机。

160×120 uncooled amorphous silicon TEC-less detector with 25μm pixel-pitch

This paper reviews characteristics and performance of a 160×120 uncooled infrared focal plane array made from amorphous silicon microbolometers with a pixel-pitch of 25μm,integrated in a LCC package compatible with mass production.The 25μm pixel architecture profits from the low thermal time constant which characterizes our technology,to design a higher pixel thermal insulation and therefore to develop a 25μm version from the well mastered 35μm technology. Thanks to a new pixel design and by pushing the design rules even further,a high fill factor has been kept,without the use of complex,as well as expensive,two-level structure. The detector is described in terms of ROIC architecture,packaging,operability and electro-optical performances.A new read out integrated circuit structure has been designed for this detector. High level functions like gain,image flip and integration time could be operated through a serial link to minimize the number of electrical interconnections.A small LCC package has been developed enabling a mass production of detectors for compact hand held or helmet mounted cameras.