我国印制电路板非ODS清洗技术现状引发的思考 |
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引用本文: | 周志春.我国印制电路板非ODS清洗技术现状引发的思考[J].洗净技术,2004(9):5-8. |
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作者姓名: | 周志春 |
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作者单位: | 电科院电子设计制造一体化中心,北京,100041 |
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摘 要: | 我国印制电路板(PCB)的非ODS清洗技术已基本解决。当今需面对的是:(1)新型元器件的组装、(2)无铅焊工艺、(5)小产量生产的清洗技术,以及(4)优化方案的思考。
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关 键 词: | 清洗、印制电路板 (PCB) ODS 无铅焊 优化 |
文章编号: | 1672-2248(2004)09-0005-04 |
修稿时间: | 2004年6月10日 |
Problems to Consider Recently for Non-ODS PCB Cleaning Technology in China |
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Authors: | Zhou Zhi-chun |
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Institution: | Electronics Design and Manufacturing Integration Center of China National Electronics ScientificResearch Institute Beijing 100041 |
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Abstract: | In general, Non-ODS PCB Cleaning technology has been resolved basically. And now weshould pay attention to get practical cleaning techniques for (1) assembly of new type devices (2) Lead-freeSoldering (3) Less Productivity and (4) design Optimization process. |
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Keywords: | Cleaning PCB ODS Lead-free Soldering Optimization |
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